Direct joining and welding with ultrashort laser pulses

被引:0
|
作者
Watanabe, Wataru [1 ]
机构
[1] Ritsumeikan Univ, Coll Sci & Engn, Dept Elect & Elect Engn, Kusatsu, Shiga 5258577, Japan
关键词
TRANSPARENT MATERIALS;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Ultrashort laser pulses can be used to directly join transparent substrates by localized melting and resolidification without any intermediate layers. I review recent advance of welding and joining of glass substrates with ultrashort laser pulses.
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页数:2
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