Direct joining and welding with ultrashort laser pulses

被引：0
|
作者：
Watanabe, Wataru [1 ]
机构：
[1] Ritsumeikan Univ, Coll Sci & Engn, Dept Elect & Elect Engn, Kusatsu, Shiga 5258577, Japan
来源：
2013 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO) | 2013年
关键词：
TRANSPARENT MATERIALS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Ultrashort laser pulses can be used to directly join transparent substrates by localized melting and resolidification without any intermediate layers. I review recent advance of welding and joining of glass substrates with ultrashort laser pulses.
引用
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页数：2
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