3D Contactless communication for IC design

3D Contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme with transmitter and receiver circuits implemented in 0.13 mu m CMOS technology and connected to 8x8 mu m(2) electrodes in the upper metal layer of different dies and with face-to-face assembly, makes available a throughput of more than 22Mbps/mu m(2) with 80 mu W/Gbps energy consumption.