Design and test of MEMS

被引：5

作者：

Courtois, B ^{[1
]}

Karam, JM ^{[1
]}

Mir, S ^{[1
]}

Lubaszewski, M ^{[1
]}

Székely, V ^{[1
]}

Rencz, M ^{[1
]}

Hofmann, K ^{[1
]}

Glesner, M ^{[1
]}

机构：

[1] TIMA Lab, F-38031 Grenoble, France

来源：

TWELFTH INTERNATIONAL CONFERENCE ON VLSI DESIGN, PROCEEDINGS | 1999年

关键词：

microsystems; microelectromechanical systems; CAD; manufacturing; testing;

D O I：

10.1109/ICVD.1999.745160

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper is dealing with design, simulation and test of MEMS (microelectromechanical systems). Bath existing tools and open research areas are addressed. An appropriate Computer-Aided Design (CAD) environment is presented. Similarities between the present development of,MEMS and the development of microelectronics decades ago are pointed out, including the migration front point tools to CAD frameworks, testing and Intellectual Property (IP) issues.

引用

页码：270 / 275

页数：6

共 50 条

[31] Special section on Design, Test, Integration and Packaging of MEMS/MOEMS, 2013
Bernard Courtois
Analog Integrated Circuits and Signal Processing, 2014, 78 : 299 - 299
[32] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
Courtois, Bernard
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (11): : 1759 - 1759
[33] Design and Test of a MEMS-Based High G Smart Sensor
Wang, Y. P.
Hsu, R. Q.
Wu, C. W.
IEEE SENSORS JOURNAL, 2011, 11 (04) : 1046 - 1050
[34] Design and Test of a MEMS Accelerometer Array for Submarine Landslide Displacement Monitoring
Ge, Yongqiang
Chen, Jiawang
Cao, Chen
He, Jiamin
Sheng, Yan
Zheng, Xinlong
MARINE TECHNOLOGY SOCIETY JOURNAL, 2021, 55 (01) : 5 - 16
[35] Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016
Pascal Nouet
Bernd Michel
Microsystem Technologies, 2018, 24 : 361 - 361
[36] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012
Courtois, Bernard
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (06): : 773 - 773
[37] Special issue on Design, Test, Integration and Packaging of MEMS and MOEMS, 2016
Nouet, Pascal
Michel, Bernd
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (01): : 361 - 361
[38] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2011
Bernard Courtois
Bernd Michel
Microsystem Technologies, 2012, 18 : 1759 - 1759
[39] Special section on Design, Test, Integration and Packaging of MEMS/MOEMS, 2013
Courtois, Bernard
ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2014, 78 (02) : 299 - 299
[40] Special issue on design, test, integration and packaging of MEMS/MOEMS, 2012
Microsystem Technologies, 2013, 19 : 773 - 773

← 1 2 3 4 5 →