NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs

被引：0
|
作者：
Lee, Yu-Min [1 ]
Wu, Tsung-Heng [1 ]
Huang, Pei-Yu [2 ]
Yang, Chi-Ping [1 ]
机构：
[1] Natl Chiao Tung Univ, Hsinchu, Taiwan
[2] Ind Technol Res Inst, Hsinchu, Taiwan
来源：
DESIGN, AUTOMATION & TEST IN EUROPE | 2013年
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
引用
收藏
页码：1379 / 1384
页数：6
相关论文
共 50 条
  • [1] Thermal Pathfinding for 3-D ICs
    Priyadarshi, Shivam
    Davis, W. Rhett
    Steer, Michael B.
    Franzon, Paul D.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (07): : 1159 - 1168
  • [2] An Analytical Placement Framework for 3-D ICs and Its Extension on Thermal Awareness
    Luo, Guojie
    Shi, Yiyu
    Cong, Jason
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2013, 32 (04) : 510 - 523
  • [3] Thermal via planning for 3-D ICs
    Cong, J
    Zhang, Y
    ICCAD-2005: INTERNATIONAL CONFERENCE ON COMPUTER AIDED DESIGN, DIGEST OF TECHNICAL PAPERS, 2005, : 745 - 752
  • [4] LUTSim: A Look-Up Table-Based Thermal Simulator for 3-D ICs
    Lee, Yu-Min
    Pan, Chi-Wen
    Huang, Pei-Yu
    Yang, Chi-Ping
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2015, 34 (08) : 1250 - 1263
  • [5] Thermal Conduction Path Analysis in 3-D ICs
    Vaisband, Boris
    Savidis, Ioannis
    Friedman, Eby G.
    2014 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2014, : 594 - 597
  • [6] I-LUTSim: An Iterative Look-Up Table Based Thermal Simulator for 3-D ICs
    Pan, Chi-Wen
    Lee, Yu-Min
    Huang, Pei-Yu
    Yang, Chi-Ping
    Lin, Chang-Tzu
    Lee, Chia-Hsin
    Chou, Yung-Fa
    Kwai, Ding-Ming
    2013 18TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2013, : 151 - 156
  • [7] Thermal-driven multilevel routing for 3-D ICs
    Cong, Jason
    Zhang, Yan
    ASP-DAC 2005: PROCEEDINGS OF THE ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2, 2005, : 121 - 126
  • [8] FPGA implementation of 3-D thermal model simulator
    Pardo, F.
    Lopez, P.
    Cabello, D.
    Balsi, M.
    2006 INTERNATIONAL CONFERENCE ON FIELD PROGRAMMABLE LOGIC AND APPLICATIONS, PROCEEDINGS, 2006, : 633 - 636
  • [9] Thermal Effects of Silicon Thickness in 3-D ICs: Measurements and Simulations
    Souare, Papa Momar
    Fiori, Vincent
    Farcy, Alexis
    de Crecy, Francois
    Ben Jamaa, Haykel
    Borbely, Andras
    Coudrain, Perceval
    Colonna, Jean-Philippe
    Gallois-Garreignot, Sebastien
    Giraud, Bastien
    Cheramy, Severine
    Tavernier, Clement
    Michailos, Jean
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (08): : 1284 - 1292
  • [10] STREAM: Stress and Thermal Aware Reliability Management for 3-D ICs
    Wang, Hai
    Huang, Darong
    Liu, Rui
    Zhang, Chi
    Tang, He
    Yuan, Yuan
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2019, 38 (11) : 2058 - 2071
12345