Torsion Fatigue Testing of Polycrystalline Silicon Cross-Microbridge Structures

被引：2
|
作者：
Hung, Jeng-Nan [1 ]
Hocheng, Hong [1 ]
Sato, Kazuo [2 ]
机构：
[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 30013, Taiwan
[2] Nagoya Univ, Dept Micronano Syst Engn, Nagoya, Aichi 4648603, Japan
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS | 2011年 / 50卷 / 06期
关键词：
HIGH-CYCLE FATIGUE; FRACTURE STRENGTH; MICROCANTILEVER BEAM; POLYSILICON; MICROSTRUCTURES; STRESS; FILMS;
D O I：
10.1143/JJAP.50.06GM07
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
In the rapid advancement of micro/nano-electro-mechanical systems (MEMS/NEMS) technology, however, the reliable applications lie in the characterization of the mechanical fatigue properties of the micro/nano-structures. This paper presents the fatigue life of polycrystalline silicon (poly-Si) cross-microbridge in torsion. The torsion testing specimens are fabricated by surface and bulk micromachining. In addition, the stresses of cross-microbridge structures are investigated at various dimensions. The numerical tool ANSYS is applied to calculate the stress distribution of the testing structure. The experimental fatigue life lies between 7.78 x 10(4)-1.48 x 10(7) cycles in use of the MTS Tytron 250 microforce testing system. The collective plot of poly-Si fatigue including the results of torsion will provide the MEMS device designer and researcher a good reference in the future applications. (c) 2011 The Japan Society of Applied Physics
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页数：5
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