Torsion Fatigue Testing of Polycrystalline Silicon Cross-Microbridge Structures

被引：2

作者：

Hung, Jeng-Nan ^{[1
]}

Hocheng, Hong ^{[1
]}

Sato, Kazuo ^{[2
]}

机构：

[1] Natl Tsing Hua Univ, Dept Power Mech Engn, Hsinchu 30013, Taiwan

[2] Nagoya Univ, Dept Micronano Syst Engn, Nagoya, Aichi 4648603, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS | 2011年 / 50卷 / 06期

关键词：

HIGH-CYCLE FATIGUE; FRACTURE STRENGTH; MICROCANTILEVER BEAM; POLYSILICON; MICROSTRUCTURES; STRESS; FILMS;

D O I：

10.1143/JJAP.50.06GM07

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

In the rapid advancement of micro/nano-electro-mechanical systems (MEMS/NEMS) technology, however, the reliable applications lie in the characterization of the mechanical fatigue properties of the micro/nano-structures. This paper presents the fatigue life of polycrystalline silicon (poly-Si) cross-microbridge in torsion. The torsion testing specimens are fabricated by surface and bulk micromachining. In addition, the stresses of cross-microbridge structures are investigated at various dimensions. The numerical tool ANSYS is applied to calculate the stress distribution of the testing structure. The experimental fatigue life lies between 7.78 x 10(4)-1.48 x 10(7) cycles in use of the MTS Tytron 250 microforce testing system. The collective plot of poly-Si fatigue including the results of torsion will provide the MEMS device designer and researcher a good reference in the future applications. (c) 2011 The Japan Society of Applied Physics

引用

页数：5

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