Photoelastic observation of stress distributions in laser cleaving of glass substrates

被引：11
|
作者：
Yamada, Keiji [1 ]
Maeda, Takahiro [2 ]
Iwai, Tomoaki [3 ]
Sekiya, Katsuhiko [1 ]
Tanaka, Ryutaro [1 ]
机构：
[1] Hiroshima Univ, Inst Engn, 1-4-1 Kagamiyama, Higashihiroshima 7398527, Japan
[2] Nippon Steel & Sumikin Engn Co Ltd, Tokyo, Japan
[3] Kanazawa Univ, Inst Sci & Engn, Kanazawa, Ishikawa 9201192, Japan
来源：
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY | 2017年 / 47卷
关键词：
Laser cleaving; Glass substrate; Dicing process; Thermal stress; Photoelasticity; CONTROLLED FRACTURE;
D O I：
10.1016/j.precisioneng.2016.09.007
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Photoelastic observations of thermal stress were conducted during the separation of glass substrates by thermal stress cleaving with a laser. A polariscope system was built in the laser cleaving system for observation during laser cleaving, and isochromatic and isoclinic fringe patterns were studied to analyze the thermal stress induced by laser irradiation. The proposed method allows for the visualization of stress asymmetry that decreases the process accuracy, and for the detection of crack stagnation which decreases the process reliability. (C) 2016 Elsevier Inc. All rights reserved.
引用
收藏
页码：333 / 343
页数：11
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