Photoelastic observation of stress distributions in laser cleaving of glass substrates

被引：11

作者：

Yamada, Keiji ^{[1
]}

Maeda, Takahiro ^{[2
]}

Iwai, Tomoaki ^{[3
]}

Sekiya, Katsuhiko ^{[1
]}

Tanaka, Ryutaro ^{[1
]}

机构：

[1] Hiroshima Univ, Inst Engn, 1-4-1 Kagamiyama, Higashihiroshima 7398527, Japan

[2] Nippon Steel & Sumikin Engn Co Ltd, Tokyo, Japan

[3] Kanazawa Univ, Inst Sci & Engn, Kanazawa, Ishikawa 9201192, Japan

来源：

PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY | 2017年 / 47卷

关键词：

Laser cleaving; Glass substrate; Dicing process; Thermal stress; Photoelasticity; CONTROLLED FRACTURE;

D O I：

10.1016/j.precisioneng.2016.09.007

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Photoelastic observations of thermal stress were conducted during the separation of glass substrates by thermal stress cleaving with a laser. A polariscope system was built in the laser cleaving system for observation during laser cleaving, and isochromatic and isoclinic fringe patterns were studied to analyze the thermal stress induced by laser irradiation. The proposed method allows for the visualization of stress asymmetry that decreases the process accuracy, and for the detection of crack stagnation which decreases the process reliability. (C) 2016 Elsevier Inc. All rights reserved.

引用

页码：333 / 343

页数：11

共 50 条

[21] Laser zone texturing on glass and glass-ceramic substrates
Kuo, D
Vierk, SD
Rauch, G
Polensky, D
IEEE TRANSACTIONS ON MAGNETICS, 1997, 33 (01) : 944 - 949
[22] Study on laser cleaving of brittle materials with two-types laser beam (precise cleaving of the thick glass materials with CO2 laser and Er:YAG laser)
Ueda, Takashi
Furumoto, Tatsuaki
Fujie, Norihisa
Hosokawa, Akira
Tanaka, Ryutaro
Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C, 2012, 78 (788): : 1295 - 1304
[23] Laser microfabrication of glass substrates by pocket scanning
Lan, B
Hong, MH
Ye, KD
Wang, ZB
Chong, TC
FOURTH INTERNATIONAL SYMPOSIUM ON LASER PRECISION MICROFABRICATION, 2003, 5063 : 133 - 136
[24] Laser etching of glass substrates by 1064 nm laser irradiation
Huang, Z. Q.
Hong, M. H.
Do, T. B. M.
Lin, Q. Y.
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2008, 93 (01): : 159 - 163
[25] LASER INDUCED IMPLANTATION DOPING OF GLASS SUBSTRATES
Sadeh, Sepehr
Mitra, Kunal
PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE, 2016, VOL 2, 2016,
[26] Laser etching of glass substrates by 1064 nm laser irradiation
Z. Q. Huang
M. H. Hong
T. B. M. Do
Q. Y. Lin
Applied Physics A, 2008, 93 : 159 - 163
[27] Laser polishing of vidicon's glass substrates
Sidorenko, S. P.
Fedosovsky, M. E.
Veiko, V. P.
Golubok, A. O.
Levichev, V. V.
Chuiko, V. A.
Yakovlev, E. B.
Shakhno, E. A.
LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING VII, 2009, 7201
[28] Laser Micromachining of Glass Substrates for Microfluidics Devices
Hossan, Mohammad Robiul
Konari, Prashanth Reddy
PROCEEDINGS OF THE 13TH INTERNATIONAL CONFERENCE ON MECHANICAL ENGINEERING (ICME2019), 2021, 2324
[29] Pulsed laser breaking technique for glass substrates
Tsai, Chwan-Huei
Chang, Wei-Han
MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY XIV, 2009, 7204
[30] PHOTOELASTIC MEASUREMENT OF RESIDUAL THERMOMECHANICAL STRESS IN SIC-REINFORCED GLASS COMPOSITES
KRYNICKI, JW
NAGLE, DC
GREEN, RE
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1992, 75 (08) : 2225 - 2231

← 1 2 3 4 5 →