The Model of Nano-Scale Copper Particle Removal from Silicon Surface in High Pressure CO2+H2O and CO2+H2O+IPA Cleaning Solutions

被引:1
|
作者
Tan, Xin [1 ]
Chai, Jiajue [1 ]
Zhang, Xiaogang [1 ]
Chen, Jiawei [2 ]
机构
[1] Renmin Univ China, Dept Chem, Beijing 100872, Peoples R China
[2] China Univ Geosci, State Key Lab Geol Proc & Mineral Resources, Beijing 100083, Peoples R China
关键词
Equilibrium Separation Distance; Net Adhesion Force; High Pressure; Supercritical CO2; SUPERCRITICAL CARBON-DIOXIDE; LOW-K DIELECTRICS; WATER; SYSTEM;
D O I
10.1166/jnn.2011.3970
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
This study focuses on the description of the static forces in CO2-H2O and CO2-H2O-IPA cleaning solutions with a separate fluid phase entrapped between nano-scale copper particles and a silicon surface. Calculations demonstrate that increasing the pressure of the cleaning system decreases net adhesion force (NAF) between the particle and silicon. The NAF of a particle for in CO2-H2O-PA system is less than that in CO2-H2O system, suggesting that the particles enter into bulk layer more easily as the CO2-H2O cleaning system is added IPA.
引用
收藏
页码:10782 / 10786
页数:5
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