New lead-free solder alloy

被引：10
|
作者：
Kamal, M [1 ]
Meikhail, MS [1 ]
El-Bediwi, AB [1 ]
Gouda, ES [1 ]
机构：
[1] Mansoura Univ, Fac Sci, Dept Phys, Met Phys Lab, Mansoura, Egypt
来源：
RADIATION EFFECTS AND DEFECTS IN SOLIDS | 2005年 / 160卷 / 07期
关键词：
lead-free solders; melting point; electrical resistivity; contact angle; wetting; pentomic addition;
D O I：
10.1080/10420150500335363
中图分类号：
TL [原子能技术]; O571 [原子核物理学];
学科分类号：
0827 ; 082701 ;
摘要：
As the electronics industry is moving towards lead-free manufacturing processes, a new lead-free solder alloy based on Sn-9Zn-1Bi-2Cu-In is described. The quaternary alloy with indium additions exhibits melting, wetting, and mechanical properties superior to those in binary, ternary, and quaternary alloys. Indium as a penternary addition decreases the melting point of this alloy to 181 degrees C which it is a lower value when compared with the eutectic Sn-Pb solder (183 degrees C), it decreases the contact angle to 23 degrees which is very close to that for Sn-Pb solder alloy, it increases the Youngs modulus to higher values, and it increases its hardness to 19 kgf/mm(2) when compared with 12.9 kgf/mm(2) for the Sn-Pb solder alloy.
引用
收藏
页码：301 / 312
页数：12
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