High-performance GaN/InGaN double heterojunction bipolar transistors with power density >240 kW/cm2

被引:3
|
作者
Zhang, Yun [1 ]
Lee, Yi-Che [1 ]
Lochner, Zachary [1 ]
Kim, Hee Jin [1 ]
Choi, Suk [1 ]
Ryou, Jae-Hyun [1 ]
Dupuis, Russell D. [1 ]
Shen, Shyh-Chiang [1 ]
机构
[1] Georgia Inst Technol, Sch ECE, Atlanta, GA 30332 USA
关键词
GaN/InGaN; heterojunction bipolar transistors; current gain; power density; HIGH-CURRENT GAIN; HIGH-VOLTAGE OPERATION; ALGAN/GAN HBTS; BASE-REGROWTH; P-INGAN; EMITTER; GROWTH;
D O I
10.1002/pssc.201001098
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We report GaN/In0.03Ga0.97N npn double heterojunction bipolar transistors (DHBTs) grown on sapphire substrates for high power applications. High current gain and high power density are obtained using a simple single-growth mesa etching process. A device with an emitter area (A(E)) of 20x20 mu m(2) achieves a peak d.c. current gain (beta) of 84, a maximum collector current density (J(C)) of 7.2 kA/cm(2) and a maximum power density > 240 kW/cm(2). A large-area (A(E) = 12163 mu m(2)) multi-finger device also shows a peak beta = 30, maximum collector current (I-c) = 200 mA and maximum d.c. power = 3.76 W. These values are among the best for the reported III-N HBTs to date. (C) 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
收藏
页码:2451 / 2453
页数:3
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