Thermographic testing methods with high temporal and spatial resolution

被引：0

作者：

Netzelmann, U ^{[1
]}

Walle, G ^{[1
]}

Karpen, W ^{[1
]}

Meyendorf, N ^{[1
]}

机构：

[1] Fraunhofer IZFP, D-66123 Saarbrucken, Germany

来源：

MICRO MATERIALS, PROCEEDINGS | 2000年

关键词：

thermography; thermal waves; nondestructive testing; wafer bonding;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Microstructures in semiconductors and in ferrite were imaged by pulsed thermography and by thermal wave microscopy. The lateral resolution ranges down to 50 mum for thermography and 5 mum for the thermal wave microscope. The resolved time scale is 1 ms and less than 10 mus. respectively. The advantage of both techniques is their contact-free operation with the ability to obtain sub-surface information.

引用

页码：1079 / 1081

页数：3

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