Thermographic testing methods with high temporal and spatial resolution

被引：0
|
作者：
Netzelmann, U [1 ]
Walle, G [1 ]
Karpen, W [1 ]
Meyendorf, N [1 ]
机构：
[1] Fraunhofer IZFP, D-66123 Saarbrucken, Germany
来源：
MICRO MATERIALS, PROCEEDINGS | 2000年
关键词：
thermography; thermal waves; nondestructive testing; wafer bonding;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Microstructures in semiconductors and in ferrite were imaged by pulsed thermography and by thermal wave microscopy. The lateral resolution ranges down to 50 mum for thermography and 5 mum for the thermal wave microscope. The resolved time scale is 1 ms and less than 10 mus. respectively. The advantage of both techniques is their contact-free operation with the ability to obtain sub-surface information.
引用
收藏
页码：1079 / 1081
页数：3
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