BIEM analysis of dynamically loaded anti-plane cracks in graded piezoelectric finite solids

Anti-plane cracks in finite functionally graded piezoelectric solids under time-harmonic loading are studied via a non-hypersingular traction based boundary integral equation method (BIEM). The formulation allows for a quadratic variation of the material properties in two directions. The boundary integral equation (BIE) system is treated by using the frequency dependent fundamental solution based on Radon transforms. Its numerical solution provides the displacements and tractions on the external boundary as well as the crack opening displacements from which the mechanical stress intensity factor (SIF) and the electrical displacement intensity factor (EDIF) are determined. Several examples for single and multiple straight and curved cracks demonstrate the applicability of the method and show the influence of the different system parameters. (C) 2010 Elsevier Ltd. All rights reserved.