BIEM analysis of dynamically loaded anti-plane cracks in graded piezoelectric finite solids

被引：11

作者：

Dineva, Petia ^{[2
]}

Gross, Dietmar ^{[3
]}

Mueller, Ralf ^{[4
]}

Rangelov, Tsviatko ^{[1
]}

机构：

[1] Bulgarian Acad Sci, Inst Math & Informat, BU-1113 Sofia, Bulgaria

[2] Bulgarian Acad Sci, Inst Mech, BU-1113 Sofia, Bulgaria

[3] Tech Univ Darmstadt, Div Solid Mech, D-64289 Darmstadt, Germany

[4] Tech Univ Kaiserslautern, Chair Appl Mech, Dept Mech & Proc Engn, D-67663 Kaiserslautern, Germany

来源：

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES | 2010年 / 47卷 / 22-23期

关键词：

Functionally graded piezoelectric solids; Anti-plane cracks; Cracks interaction; Non-hypersingular BIEM; Generalized SIF computation; MODE-III CRACK; 2 COLLINEAR CRACKS; SHEAR-WAVES; BEHAVIOR; SCATTERING; COMPOSITE; EQUATION; FRACTURE;

D O I：

10.1016/j.ijsolstr.2010.07.017

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

Anti-plane cracks in finite functionally graded piezoelectric solids under time-harmonic loading are studied via a non-hypersingular traction based boundary integral equation method (BIEM). The formulation allows for a quadratic variation of the material properties in two directions. The boundary integral equation (BIE) system is treated by using the frequency dependent fundamental solution based on Radon transforms. Its numerical solution provides the displacements and tractions on the external boundary as well as the crack opening displacements from which the mechanical stress intensity factor (SIF) and the electrical displacement intensity factor (EDIF) are determined. Several examples for single and multiple straight and curved cracks demonstrate the applicability of the method and show the influence of the different system parameters. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：3150 / 3165

页数：16

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