Physical design for 3D system on package

被引：0
|
作者：
Lim, SK [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
IEEE DESIGN & TEST OF COMPUTERS | 2005年 / 22卷 / 06期
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：532 / 539
页数：8
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