Design of a CAN Bus Communication System Based on 3D Package

被引：0
|
作者：
Yang Fan [1 ]
Yang Chao [1 ]
Xu Zhen [1 ]
Tang Ke-ran [1 ]
Pang You-Bing [1 ]
Zhang Tian-xing [1 ]
机构：
[1] China Elect Technol Grp Corp, Sichuan Inst Solid State Circuits, Chongqing, Peoples R China
来源：
2018 10TH INTERNATIONAL CONFERENCE ON COMMUNICATIONS, CIRCUITS AND SYSTEMS (ICCCAS 2018) | 2018年
关键词：
3D package; CAN BUS; SIP;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A Miniaturization and Isolation CAN Bus communication system circuit based on 3D package is presented in this paper. This circuit brings the advanced stacked 3D package technology to makes the CAN BUS Controller, Isolator, CAN BUS Transceiver, Crystal Oscillator, Power Management and so on to bury in three PCB board, and forms the SIP package of 15mm(star)15mm(star)4mm. Compared with the general devices on the market, the circuit volume is reduced by 2/3.
引用
收藏
页码：301 / 304
页数：4
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