Ion Milling of Ex Situ Lift-Out FIB Specimens

被引：0

作者：

Campin, M. J. ^{[1
]}

Bonifacio, C. S. ^{[1
]}

Boccabella, M. ^{[1
]}

Fischione, P. E. ^{[1
]}

Kang, H. H. ^{[2
]}

机构：

[1] EA Fischione Instruments Inc, Export, PA 15632 USA

[2] GLOBALFOUNDARIES, Ctr Complex Anal, Malta, NY 12020 USA

来源：

ISTFA 2017: CONFERENCE PROCEEDINGS FROM THE 43RD INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS | 2017年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

The semiconductor industry is constantly investigating new methods that can improve both the quality of TEM lamella and the speed at which they can be created. To improve throughput, a combination of FIB-based preparation and ex situ lift-out (EXLO) techniques have been used. Unfortunately, the carbon support on the EXLO grid presents problems if the lamella needs to be thinned once it is on the grid. In this paper, we present low-energy (<1 keV), narrow-beam (<1 gm diameter), Ar+ ion milling as a method of preparing electron transparent and gallium-free EXLO FIB specimens.

引用

下载

页码：260 / 264

页数：5

共 50 条

[1] Variations on FIB in situ Lift-Out for TEMSample Preparation
Hartfield, Cheryl
Hammer, Matt
Amador, Gonzalo
Moore, Tom
Electronic Device Failure Analysis, 2011, 13 (03): : 18 - 26
[2] Optimizing ex situ Lift Out for Frontside or Backside FIB Milling
Giannuzzi, Lucille A.
ISTFA 2017: CONFERENCE PROCEEDINGS FROM THE 43RD INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2017, : 275 - 278
[3] Study of FIB Milling Induced Damage and Contamination on Ex-situ Lift-out TEM Specimen and Methodology to Reduce the Artifacts
Nan, Liew Kaeng
Lung, Lee Meng
PROCEEDINGS OF THE 2013 20TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2013), 2013, : 404 - 407
[4] In situ lift-out using a FIB-SEM system
Langford, RM
Clinton, C
MICRON, 2004, 35 (07) : 607 - 611
[5] Vacuum Assisted ex situ Lift Out for Manipulation of FIB Prepared Specimens
Giannuzzi, Lucille A.
Hess, Dustin
Clark, Trevor
ISTFA 2015: CONFERENCE PROCEEDINGS FROM THE 41ST INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2015, : 61 - 64
[6] Using the in situ lift-out technique to prepare TEM specimens on a single-beam FIB instrument
Lekstrom, M.
McLachlan, M. A.
Husain, S.
McComb, D. W.
Shollock, B. A.
EMAG: ELECTRON MICROSCOPY AND ANALYSIS GROUP CONFERENCE 2007, 2008, 126
[7] TRANSFORMING AN INDUSTRY: AN INVENTOR’S TALE OF FIB IN SITU LIFT-OUT
Hartfield C.
Electronic Device Failure Analysis, 2023, 25 (01): : 20 - 27
[8] Serial lift-out for in situ structural biology of multicellular specimens
Wang, Zhexin
Bharat, Tanmay A. M.
NATURE METHODS, 2024, 21 (09) : 1587 - 1588
[9] Sample preparation for nanoanalytical electron microscopy using the FIB lift-out method and low energy ion milling
Scott, J.
T Docherty, F.
MacKenzie, M.
Smith, W.
Miller, B.
Collins, C. L.
Craven, A. J.
EMAG-NANO 2005: IMAGING, ANALYSIS AND FABRICATION ON THE NANOSCALE, 2006, 26 : 223 - +
[10] FIB lift-out STEM failure analysis technique
Stevie, FA
Vartuli, CB
PROCEEDINGS OF THE 9TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2002, : 157 - 158

← 1 2 3 4 5 →