TRANSFORMING AN INDUSTRY: AN INVENTOR’S TALE OF FIB IN SITU LIFT-OUT

被引：0
|
作者：
Hartfield C. [1 ]
机构：
[1] Carl Zeiss Microscopy LLC, Dublin, CA
来源：
Electronic Device Failure Analysis | 2023年 / 25卷 / 01期
关键词：
FIB lift-out; in situ lift-out; Omniprobe; TEM sample preparation;
D O I：
10.31399/asm.edfa.2023-1.p020
中图分类号：
学科分类号：
摘要：
This is the story of how the mainstream Omniprobe FIB lift-out solution was invented and delivered to the market. © ASM International.
引用
下载
收藏
页码：20 / 27
页数：7
相关论文
共 42 条
  • [1] Variations on FIB in situ Lift-Out for TEMSample Preparation
    Hartfield, Cheryl
    Hammer, Matt
    Amador, Gonzalo
    Moore, Tom
    Electronic Device Failure Analysis, 2011, 13 (03): : 18 - 26
  • [2] In situ lift-out using a FIB-SEM system
    Langford, RM
    Clinton, C
    MICRON, 2004, 35 (07) : 607 - 611
  • [3] Ion Milling of Ex Situ Lift-Out FIB Specimens
    Campin, M. J.
    Bonifacio, C. S.
    Boccabella, M.
    Fischione, P. E.
    Kang, H. H.
    ISTFA 2017: CONFERENCE PROCEEDINGS FROM THE 43RD INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2017, : 260 - 264
  • [4] FIB lift-out STEM failure analysis technique
    Stevie, FA
    Vartuli, CB
    PROCEEDINGS OF THE 9TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2002, : 157 - 158
  • [5] Applications of the FIB lift-out technique for TEM specimen preparation
    Giannuzzi, LA
    Drown, JL
    Brown, SR
    Irwin, RB
    Stevie, F
    MICROSCOPY RESEARCH AND TECHNIQUE, 1998, 41 (04) : 285 - 290
  • [6] Using the in situ lift-out technique to prepare TEM specimens on a single-beam FIB instrument
    Lekstrom, M.
    McLachlan, M. A.
    Husain, S.
    McComb, D. W.
    Shollock, B. A.
    EMAG: ELECTRON MICROSCOPY AND ANALYSIS GROUP CONFERENCE 2007, 2008, 126
  • [7] In situ lift-out: Steps to improve yield and a comparison with other FIB TEM sample preparation techniques
    Langford, R. M.
    Rogers, M.
    MICRON, 2008, 39 (08) : 1325 - 1330
  • [8] In situ lift-out dedicated techniques using FIB-SEM system for TEM specimen preparation
    Tomus, Dacian
    Ng, Hoi Pang
    MICRON, 2013, 44 : 115 - 119
  • [9] FIB lift-out of conducting ferroelectric domain walls in hexagonal manganites
    Mosberg, Aleksander B.
    Roede, Erik D.
    Evans, Donald M.
    Holstad, Theodor S.
    Bourret, Edith
    Yan, Zewu
    van Helvoort, Antonius T. J.
    Meier, Dennis
    APPLIED PHYSICS LETTERS, 2019, 115 (12)
  • [10] Novel application of FIB lift-out and ultramicrotomy for advanced package failure analysis
    Mohammad, KN
    Sim, KS
    PROCEEDINGS OF THE 9TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2002, : 159 - 163
12345