Electro-Thermal Investigation of SMT Resistors for Thermal-Electrical Logic Circuits by Simulation

被引:2
|
作者
Pohl, Laszlo [1 ]
Darwish, Mahmoud [1 ]
Mizsei, Janos [1 ]
机构
[1] Budapest Univ Technol & Econ BME, Budapest, Hungary
关键词
TRANSITION;
D O I
10.1109/therminic.2019.8923402
中图分类号
O414.1 [热力学];
学科分类号
摘要
Thermal-electrical logic circuits can be a possible alternative to CMOS technology. The basic element of these circuits is the vanadium dioxide resistor. Currently, only macroscopic models exist for the operation of VO2 resistors. The development of a submicron model requires the design, production and measurement of submicron-sized samples. In this paper, high-resolution electro-thermal VO2 resistor simulations are performed using a macroscopic material model in the range of 200 mu m to 50 nm resistor width and 20 mu m to 50 nm length with 50 nm layer thickness. These results in the submicron range can only be considered as estimates, but they can be used to determine the size of the samples required for submicron modelling.
引用
收藏
页数:4
相关论文
共 50 条
  • [21] Electro-thermal and logi-thermal simulation of VLSI designs
    Szekely, V
    Poppe, A
    Pahi, A
    Csendes, A
    Hajas, G
    Rencz, M
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 1997, 5 (03) : 258 - 269
  • [22] Automatic Thermal Network Extraction and Multiscale Electro-Thermal Simulation
    Culpo, Massimiliano
    de Falco, Carlo
    Denk, Georg
    Voigtmann, Steffen
    SCIENTIFIC COMPUTING IN ELECTRICAL ENGINEERING SCEE 2008, 2010, 14 : 281 - +
  • [23] A method for tightly coupled thermal-electrical simulation
    Klaassen, B
    MICROELECTRONICS JOURNAL, 1997, 28 (03) : 239 - 245
  • [24] Electro-thermal coupling analysis methodology for RF circuits
    Gomez, Didac
    Dufis, Cedric
    Altet, Josep
    Mateo, Diego
    Luis Gonzalez, Jose
    MICROELECTRONICS JOURNAL, 2012, 43 (09) : 633 - 641
  • [25] VIRTUAL PROTOTYPING AND SIMULATION OF ELECTRO-THERMAL SYSTEMS
    Hauck, Torsten
    Jha, Vibhash
    2019 20TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2019,
  • [26] Numerical Simulation of Electro-thermal Deicing Process
    Chang Shinan
    Tu Min
    Ai Suxiao
    PROGRESS IN SAFETY SCIENCE AND TECHNOLOGY, VOL VII, PTS A AND B, 2008, 7 : 2033 - 2038
  • [27] Dynamic electro-thermal simulation of microsystems - a review
    Bechtold, T
    Rudnyi, EB
    Korvink, JG
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2005, 15 (11) : R17 - R31
  • [28] A Fast Inverter Model for Electro-Thermal Simulation
    Gragger, Johannes V.
    Fenz, Claus J.
    Kernstock, Harald
    Kral, Christian
    2012 TWENTY-SEVENTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2012, : 2548 - 2555
  • [29] Fully coupled dynamic electro-thermal simulation
    Digele, G
    Lindenkreuz, S
    Kasper, E
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 1997, 5 (03) : 250 - 257
  • [30] Electro-thermal simulation and characterization of preconcentration membranes
    Ingles, R.
    Pallares, J.
    Gracia, I.
    Gue, A. M.
    Ramirez, J. L.
    SENSORS AND ACTUATORS A-PHYSICAL, 2011, 172 (01) : 124 - 128