Synthesis and characterization of nanocomposite Fe3O4/SiO2 core-shell abrasives for high-efficiency ultrasound-assisted magneto-rheological polishing of sapphire

被引:33
|
作者
Zhai, Quan [1 ]
Zhai, Wenjie [1 ]
Gao, Bo [1 ]
Shi, Yiqing [1 ]
Cheng, Xi [1 ]
机构
[1] Harbin Inst Technol, Sch Mechatron Engn, Harbin 150001, Heilongjiang, Peoples R China
基金
中国国家自然科学基金;
关键词
Fe3O4; SiO2 core-shell abrasives; Ultrasonic vibration; Magneto-rheological polishing; Sapphire wafer; Surface roughness; Material removal rate; MATERIAL REMOVAL; MAGNETORHEOLOGICAL FLUID; COMPOUND; SIO2; NANOPARTICLES; SILICA; CMP; PERFORMANCES; ANISOTROPY; MODEL;
D O I
10.1016/j.ceramint.2021.08.047
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A functional Fe3O4/SiO2 core-shell abrasive was synthesized via hydrolysis of tetraethyl orthosilicate. A silica shell was successfully coated on a Fe3O4 core, resulting in a core-shell particle with an average diameter of 140 nm. The prepared core-shell abrasives was utilized for ultrasound-assisted magneto-rheological polishing (UAMP) of sapphire substrate. The experimental results showed that the Fe3O4/SiO2 core-shell abrasives exhibited a remarkable polishing performance for the sapphire material, resulting in smooth and detect-free surfaces with a high material removal rate (MRR) compared to mixed abrasives (Fe3O4 and SiO2) and pure Fe3O4 particles. The application of ultrasonic vibration to the sapphire wafer further improved the MRR, which was approximately 3.4 times higher than that of traditional magneto-rheological polishing. The largest MRR (1.974 mu m/h) and comparatively low surface roughness (0.442 nm) of the polished sapphire wafer were achieved by UAMP with the Fe3O4/SiO2 core-shell abrasives. The polishing mechanism of the sapphire wafer is discussed in terms of chemical reactions and mechanical polishing.
引用
收藏
页码:31681 / 31690
页数:10
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