Surface Relief and Porous Structure Patterning of Polyimide

被引：3
|
作者：
Kodera, Fumiaki [1 ]
Matsuzawa, Yasushi [1 ]
Okano, Kunihiko [1 ]
Tomiyama, Etsuko [1 ]
Yamashita, Takashi [1 ]
机构：
[1] Tokyo Univ Sci, Dept Pure & Appl Chem, Fac Sci & Technol, Chiba 2788510, Japan
来源：
JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY | 2010年 / 23卷 / 02期
关键词：
polyimide; photo acid generator; photo base generator; porous structure patterning; CROSS-LINKING REACTIONS; PHOTOSENSITIVE POLYIMIDE; ALICYCLIC DIAMINE; LITHOGRAPHY; PHOTOCONDUCTIVITY; SALTS;
D O I：
10.2494/photopolymer.23.235
中图分类号：
O63 [高分子化学（高聚物）];
学科分类号：
070305 ; 080501 ; 081704 ;
摘要：
Polyimides have excellent properties such as thermo stability, mechanical strength, and chemical stability, which are widely used as the materials for microelectronics and aerospace. We discover the new process of porous structure patterning and surface relief patterning. Porous structure patterning of polyimide is based on poly (amide acid) and photo acid generator (PAG, NAI100). Photo irradiation of the PAA in the presence of PAG induce surface relief grating after thermal imidization. The tone can be controlled using PAG or PBG. The mechanism of the pattern formation is based on the change in imidization temperature by the PAG or PBG.
引用
收藏
页码：235 / 240
页数：6
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