Fabrication of copper clad aluminum wire(CCAW) by indirect extrusion and drawing

被引:14
|
作者
Kwon, HC
Jung, TK
Lim, SC
Kim, MS
机构
[1] Korea Inst Ind Technol, Inchon 404254, South Korea
[2] Inha Univ, Sch Mat Sci & Engn, Inchon 402751, South Korea
关键词
indirect extrusion; copper clad aluminum wire(CCAW);
D O I
10.4028/www.scientific.net/MSF.449-452.317
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The optimized extrusion conditions from the present research were the extrusion temperature of 573similar to623K and the extrusion ratio(A(0)/A) of 21.39. Above the extrusion temperature of 623K, the fracture of sheath material was observed. It is due to the difference of flow stress between the sheath material and the core material during extrusion process. The bonding strength increased with increasing the extrusion temperature and the extrusion ratio. The bonding strength increased with increasing the annealing temperature. However, over 573K, it decreased abruptly since the thick and brittle intermetallic compounds of larger than 3 mum were formed. The electrical conductivity of copper clad aluminum wire was about 70%IACS without annealing.
引用
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页码:317 / 320
页数:4
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