Characterization and modelling of cure kinetics of a molding compound

Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process. In this paper, the cure kinetics of a molding compound is described by the Kamal-Sourour equation, including the effect of diffusion limitation, and the corresponding parameters are determined. Furthermore, a preliminary dynamic mechanical experiment during cure is presented to show an application of our cure kinetic model.