Characterization and modelling of cure kinetics of a molding compound

被引：0
|
作者：
Qian, C. [1 ]
Jansen, K. M. B. [1 ]
Ernst, L. J. [1 ]
Bohm, C. [2 ]
Kessler, A. [2 ]
Preu, H. [2 ]
Stecher, M. [2 ]
机构：
[1] Delft Univ Technol, Mekelweg 2, NL-2628 CD Delft, Netherlands
[2] Infineon Technol AG AIM AP, D-81726 Munich, Germany
来源：
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2007年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Packaging failures has always been the bottleneck of the development on the new techniques of IC packaging using molding compounds. Numerous simulations are developed to minimize the maximum stress during or after the packaging process. Within those simulations, a reliable kinetic model is indispensable since the viscoelastic properties are related strongly with conversion during the cure process. In this paper, the cure kinetics of a molding compound is described by the Kamal-Sourour equation, including the effect of diffusion limitation, and the corresponding parameters are determined. Furthermore, a preliminary dynamic mechanical experiment during cure is presented to show an application of our cure kinetic model.
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页码：156 / +
页数：2
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