Electroless deposition of copper alloy in the PEG additive

被引：0
|
作者：
Zhang, Wenjing [1 ]
Wang, Ning [2 ]
Hang, Tao [2 ]
Li, Ming [2 ]
机构：
[1] Shanghai Tech Univ, Sch Phys Sci & Technol, Shanghai, Peoples R China
[2] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai, Peoples R China
来源：
2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2015年
关键词：
Copper alloy; Electroless plating; micro/nano structure; PEG; PLATING TECHNOLOGY; IMPROVEMENT; ADHESION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, Cu alloy with rough micro-scale morphology was successfully electroless plated with the help of polyethylene glycol (PEG) additive. The morphology was observed by SEM and electrochemical mechanism of micro-nano-structured Cu alloy formation was analyzed using linear sweep voltammetry. Results show that increase in PEG concentration could inhibit the anodic and cathodic reaction and the growth of secondary structure on the cone surface. The different type of crystallization modifier could result in different surface morphology. And the adsorption effect of PEG increases with the molecular weight.
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页数：4
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