Electroless deposition of copper alloy in the PEG additive

被引：0
|
作者：
Zhang, Wenjing [1 ]
Wang, Ning [2 ]
Hang, Tao [2 ]
Li, Ming [2 ]
机构：
[1] Shanghai Tech Univ, Sch Phys Sci & Technol, Shanghai, Peoples R China
[2] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, Shanghai, Peoples R China
来源：
2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY | 2015年
关键词：
Copper alloy; Electroless plating; micro/nano structure; PEG; PLATING TECHNOLOGY; IMPROVEMENT; ADHESION;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, Cu alloy with rough micro-scale morphology was successfully electroless plated with the help of polyethylene glycol (PEG) additive. The morphology was observed by SEM and electrochemical mechanism of micro-nano-structured Cu alloy formation was analyzed using linear sweep voltammetry. Results show that increase in PEG concentration could inhibit the anodic and cathodic reaction and the growth of secondary structure on the cone surface. The different type of crystallization modifier could result in different surface morphology. And the adsorption effect of PEG increases with the molecular weight.
引用
下载
收藏
页数：4
相关论文
共 50 条
  • [31] MICROSTRUCTURE EVOLUTION DURING ELECTROLESS COPPER DEPOSITION
    KIM, J
    WEN, SH
    JUNG, DY
    JOHNSON, RW
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1984, 28 (06) : 697 - 710
  • [32] Electroless copper deposition in the photographic gelatin layer
    Zhang, YH
    Yan, TT
    Yu, SQ
    Zhuang, SY
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (04) : 1270 - 1272
  • [33] Study of electroless copper deposition for ULSI metallization
    Liu, KY
    Goh, WL
    Tse, MS
    ISIC-99: 8TH INTERNATIONAL SYMPOSIUM ON INTEGRATED CIRCUITS, DEVICES & SYSTEMS, PROCEEDINGS, 1999, : 138 - 141
  • [34] ROLE OF NICKEL IONS IN ELECTROLESS COPPER DEPOSITION
    GHRIST, WJ
    PERRIN, GG
    SIMOLIUN.S
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1971, 118 (08) : C219 - &
  • [35] FEASIBILITY STUDY OF ELECTROLESS COPPER DEPOSITION FOR VLSI
    PALMANS, R
    MAEX, K
    APPLIED SURFACE SCIENCE, 1991, 53 : 345 - 352
  • [36] Surface development during electroless copper deposition
    Weber, CJ
    Pickering, HW
    Weil, KG
    PROCEEDINGS OF THE THIRD SYMPOSIUM ON ELECTROCHEMICALLY DEPOSITED THIN FILMS, 1997, 96 (19): : 91 - 102
  • [37] Electroless copper deposition: Interconnecting modern communication
    Mulzer, Catherine
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2017, 254
  • [38] Copper deposition on Pd membranes by electroless plating
    Acha, E.
    van Delft, Y. C.
    Overbeek, J.
    Arias, P. L.
    Cambra, J. F.
    INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, 2011, 36 (20) : 13114 - 13121
  • [39] LASER INTERFEROMETRY OF ELECTROLESS DEPOSITION OF COPPER SELENIDE
    OBRIEN, RN
    SANTHANAM, KSV
    JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1989, 260 (01): : 231 - 235
  • [40] ELECTROLESS COPPER DEPOSITION ON METALS AND METAL SILICIDES
    MAK, CY
    MRS BULLETIN, 1994, 19 (08) : 55 - 61
12345