Non-Overlapping Power/Ground Planes for Localized Power Distribution Network Design

被引：0

作者：

Engin, A. Ege ^{[1
]}

Ndip, Ivan ^{[2
]}

Lang, Klaus-Dieter ^{[2
]}

Aguirre, Jerry ^{[3
]}

机构：

[1] San Diego State Univ, 5500 Campanile Dr, San Diego, CA 92182 USA

[2] Fraunhofer Inst IZM, Gustav Meyer Allee 25, D-13355 Berlin, Germany

[3] Kyocera North Amer, 8611 Balboa Ave, San Diego, CA 92123 USA

来源：

2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM | 2016年

基金：

美国国家科学基金会;

关键词：

PRINTED-CIRCUIT BOARDS;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Power/ground planes are used for low IR-drop and inductance, but they also cause switching noise coupling globally across chip packages and printed circuit boards. The switching noise coupling is a concern for mixed-signal boards, highspeed I/Os, and electromagnetic compatibility. In GHz frequency regime, switching noise cannot be controlled by off-chip discrete decoupling capacitors due to their inductance. In this paper we introduce the non-overlapping power/ground planes design methodology for filtering of GHz power plane noise. Unlike existing approaches, our approach is simple, has wide bandwidth, and does not increase IR-drop or inductance.

引用

页码：7 / 9

页数：3

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