Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design

被引：55
|
作者：
Kim, Jingook [1 ]
Ren, Liehui [1 ]
Fan, Jun [1 ]
机构：
[1] Missouri Univ Sci & Technol, Missouri S&T Electromagnet Compatibil Lab, Rolla, MO 65401 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2010年 / 58卷 / 09期
关键词：
Cavity model; decoupling capacitor; equivalent total inductance; integrated circuit (IC) pin layout; parallel planes; power distribution network (PDN); via inductance extraction; NOISE; BUS;
D O I：
10.1109/TMTT.2010.2058278
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A systematic approach for inductance extraction for via arrays between two parallel planes is presented. Both self and mutual inductance values are obtained based on a cavity model. The physics associated with the via inductances is analyzed, and a rigorous method is developed to derive an equivalent total inductance for multiple via arrays. Analytical equations for the equivalent total inductance are derived in closed forms for simple cases. The proposed method is corroborated with measurements, and application of the method for power distribution network designs is demonstrated.
引用
收藏
页码：2434 / 2447
页数：14
相关论文
共 50 条
  • [1] Inductance Extraction of Grid Power Distribution Network
    Ding, Wei-Ying
    Wei, Xing-Chang
    Shu, Yu-Fei
    Yi, Da
    Xiang, Tie-Ming
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (06): : 1066 - 1072
  • [2] Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays
    Mueller, Sebastian
    Duan, Xiaomin
    Kotzev, Miroslav
    Zhang, Yao-Jiang
    Fan, Jun
    Gu, Xiaoxiong
    Kwark, Young H.
    Rimolo-Donadio, Renato
    Bruens, Heinz-Dietrich
    Schuster, Christian
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2012, 54 (05) : 1125 - 1136
  • [3] Analytical Extraction of Via-Via Inductance by Using SMM for Power-Ground Planes
    Luo, Guang-Xiao
    Wei, Xing-Chang
    Cui, Xiang
    Li, Er-Ping
    2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
  • [4] A physics-based power diode model optimized through experiment based parameter extraction
    Chibante, Rui
    Araujo, Armando
    Carvalho, Adriano
    2007 EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS, VOLS 1-10, 2007, : 2737 - +
  • [5] Parameter Extraction Procedure for a Physics-Based Power SiC Schottky Diode Model
    Fu, Ruiyun
    Grekov, Alexander E.
    Peng, Kang
    Santi, Enrico
    IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2014, 50 (05) : 3558 - 3568
  • [6] Top-layer Inductance Extraction for the Pre-layout Power Integrity Using the Physics-based Model Size Reduction (PMSR) Method
    Cao, Ying S.
    Makharashvili, Tamar
    Connor, Samuel
    Archambeault, Bruce
    Jiang, Li Jun
    Ruehli, Albert E.
    Fan, Jun
    Drewniak, James. L.
    2016 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2016, : 324 - 329
  • [7] Inductance Extraction for Physics-Based Modeling of Power Net Area Fills with Complex Shapes and Voids using the Plane-Pair PEEC Method
    Bai, Siqi
    Huang, Chenxi
    Zhao, Biyao
    Fan, Jun
    Rueli, Albert
    Drewniak, James
    Archambeault, Bruce
    Connor, Samuel
    Cracraft, Michael
    Cocchini, Matteo
    Achkir, Brice
    2016 IEEE/ACES INTERNATIONAL CONFERENCE ON WIRELESS INFORMATION TECHNOLOGY AND SYSTEMS (ICWITS) AND APPLIED COMPUTATIONAL ELECTROMAGNETICS (ACES), 2016,
  • [8] Parameter Extraction Procedure for a Physics-based Power SiC Schottky Diode Model
    Fu, Ruiyun
    Grekov, Alexander
    Peng, Kang
    Santi, Enrico
    2013 TWENTY-EIGHTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2013), 2013, : 545 - 552
  • [9] Power Integrity with Voltage Ripple Spectrum Decomposition for Physics-based Design
    Huang, Chenxi
    Zhao, Biyao
    Shringarpure, Ketan
    Bai, Siqi
    Fang, Xiang
    Makharashvili, Tamar
    Ye, Hanqin
    Cao, Ying S.
    Cracraft, Michael
    Cocchini, Matteo
    Connor, Samuel
    Gaumer, Quinn
    Scearce, Stephen
    Archambeault, Bruce
    Achkir, Brice
    Li, Erping
    Jiang, Lijun
    Ruehli, Albert
    Fan, Jun
    Drewniak, James
    2016 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2016, : 318 - 323
  • [10] Non-Overlapping Power/Ground Planes for Localized Power Distribution Network Design
    Engin, A. Ege
    Ndip, Ivan
    Lang, Klaus-Dieter
    Aguirre, Jerry
    2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM, 2016, : 7 - 9
12345