Physics-Based Inductance Extraction for Via Arrays in Parallel Planes for Power Distribution Network Design

被引：55
|
作者：
Kim, Jingook [1 ]
Ren, Liehui [1 ]
Fan, Jun [1 ]
机构：
[1] Missouri Univ Sci & Technol, Missouri S&T Electromagnet Compatibil Lab, Rolla, MO 65401 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2010年 / 58卷 / 09期
关键词：
Cavity model; decoupling capacitor; equivalent total inductance; integrated circuit (IC) pin layout; parallel planes; power distribution network (PDN); via inductance extraction; NOISE; BUS;
D O I：
10.1109/TMTT.2010.2058278
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A systematic approach for inductance extraction for via arrays between two parallel planes is presented. Both self and mutual inductance values are obtained based on a cavity model. The physics associated with the via inductances is analyzed, and a rigorous method is developed to derive an equivalent total inductance for multiple via arrays. Analytical equations for the equivalent total inductance are derived in closed forms for simple cases. The proposed method is corroborated with measurements, and application of the method for power distribution network designs is demonstrated.
引用
收藏
页码：2434 / 2447
页数：14
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