Non-Overlapping Power/Ground Planes for Localized Power Distribution Network Design

被引：0
|
作者：
Engin, A. Ege [1 ]
Ndip, Ivan [2 ]
Lang, Klaus-Dieter [2 ]
Aguirre, Jerry [3 ]
机构：
[1] San Diego State Univ, 5500 Campanile Dr, San Diego, CA 92182 USA
[2] Fraunhofer Inst IZM, Gustav Meyer Allee 25, D-13355 Berlin, Germany
[3] Kyocera North Amer, 8611 Balboa Ave, San Diego, CA 92123 USA
来源：
2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM | 2016年
基金：
美国国家科学基金会;
关键词：
PRINTED-CIRCUIT BOARDS;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Power/ground planes are used for low IR-drop and inductance, but they also cause switching noise coupling globally across chip packages and printed circuit boards. The switching noise coupling is a concern for mixed-signal boards, highspeed I/Os, and electromagnetic compatibility. In GHz frequency regime, switching noise cannot be controlled by off-chip discrete decoupling capacitors due to their inductance. In this paper we introduce the non-overlapping power/ground planes design methodology for filtering of GHz power plane noise. Unlike existing approaches, our approach is simple, has wide bandwidth, and does not increase IR-drop or inductance.
引用
收藏
页码：7 / 9
页数：3
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