Gap filling

被引：0
|
作者：
Konforti, B
机构：
来源：
NATURE STRUCTURAL & MOLECULAR BIOLOGY | 2005年 / 12卷 / 05期
关键词：
D O I：
暂无
中图分类号：
Q5 [生物化学]; Q7 [分子生物学];
学科分类号：
071010 ; 081704 ;
摘要：
DNA base excision repair is a multistep process that fixes damage to and loss of DNA bases. Base excision repair is initiated when a DNA glycosylase recognizes and cleaves the N-glycosylic bond that links the base to the phosphodiester backbone. Next the AP endonuclease cleaves the DNA backbone and removes someneighboring nucleotides. Finally, the gap is filled and sealed by DNA polymerase I and DNA ligase.
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收藏
页码：394 / 394
页数：1
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