Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays

被引:2
|
作者
Wang, Xinyuan [1 ]
Yu, Tianyi [1 ]
Hsiao, Hsuan [1 ]
Anderson, Jason [1 ]
机构
[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON, Canada
关键词
D O I
10.1109/ASAP52443.2021.00043
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
We consider double-pumped interconnect as a means of area reduction in coarse-grained reconfigurable arrays (CGRAs). Interconnect multiplexers comprise a considerable portion ()I' CGRA area. We apply double-pumping to halve the word-width of the interconnect multiplexers, saving area. The interconnect is operated at twice the system clock frequency, where the top and bottom half-words of a value are communicated in the first and second half of a clock cycle. Several circuit-level approaches for double-pumping are considered, and evaluated in different CGRA architectures with varied interconnect richness. Area and performance consequences are assessed through a 45nm standard-cell ASIC implementation. Overall CGRA area improvements of up to 16% are observed, depending on the CGRA architecture and double-pumping implementation.
引用
收藏
页码:242 / 249
页数:8
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