Coding-aware Link Energy Estimation for 2D and 3D Networks-on-Chip with Virtual Channels

被引:0
|
作者
Bamberg, Lennart [1 ]
Joseph, Jan Moritz [2 ]
Schmidt, Robert [1 ]
Pionteck, Thilo [2 ]
Garcia-Ortiz, Alberto [1 ]
机构
[1] Univ Bremen, Inst Electrodynam & Microelect ITEM Ids, Bremen, Germany
[2] Otto von Guericke Univ, Inst Informat & Commun Technol IIKT, Magdeburg, Germany
关键词
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Network-on-chip (NoC) is the most promising design paradigm for the interconnect architecture of a multiprocessor system-on-chip (MPSoC). On the downside, a NoC has a significant impact on the overall energy consumption of the system. This work presents the first technique to precisely estimate the data dependent link energy consumption in NoCs with virtual channels. Our model works at a high level of abstraction, making it feasible to estimate the energy requirements at an early design stage. Additionally, it enables the fast evaluation and early exploration of low-power coding techniques. The presented model is applicable for 2D as well as 3D NoCs. A case study for an image processing application shows that the current link model leads to an underestimate of the link energy consumption by up to a factor of four. In contrast, the technique presented in this paper estimates the energy quantities precisely (error below 1 %).
引用
收藏
页码:222 / 228
页数:7
相关论文
共 50 条
  • [21] Dynamically Reconfigurable Architecture for Fault-tolerant 2D Networks-on-Chip
    Bahrebar, Poona
    Jalalvand, Azarakhsh
    Stroobandt, Dirk
    [J]. 2017 26TH INTERNATIONAL CONFERENCE ON COMPUTER COMMUNICATION AND NETWORKS (ICCCN 2017), 2017,
  • [22] A Novel Topology Reconfiguration Backtracking Algorithm for 2D REmesh Networks-on-Chip
    Niu, Na
    Fu, Fang-Fa
    Li, Hang
    Lai, Feng-Chang
    Wang, Jin-Xiang
    [J]. PARALLEL ARCHITECTURE, ALGORITHM AND PROGRAMMING, PAAP 2017, 2017, 729 : 51 - 58
  • [23] 2D/3D VIRTUAL FACE MODELING
    Chung, SoonKee
    Bazin, Jean-Charles
    Kweon, Inso
    [J]. 2011 18TH IEEE INTERNATIONAL CONFERENCE ON IMAGE PROCESSING (ICIP), 2011, : 1097 - 1100
  • [24] 2D Advertising in 3D Virtual Spaces
    Berki, Borbala
    [J]. ACTA POLYTECHNICA HUNGARICA, 2018, 15 (03) : 175 - 190
  • [25] A Low Overhead Fault Tolerant Routing Scheme for 3D Networks-on-Chip
    Pasricha, Sudeep
    Zou, Yong
    [J]. 2011 12TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED), 2011, : 204 - 211
  • [26] Adaptive inter-layer message routing in 3D networks-on-chip
    Rusu, Claudia
    Anghel, Lorena
    Avresky, Dimiter
    [J]. MICROPROCESSORS AND MICROSYSTEMS, 2011, 35 (07) : 613 - 631
  • [27] Pipeline-Based Interlayer Bus Structure for 3D Networks-on-Chip
    Daneshtalab, Masoud
    Ebrahimi, Masoumeh
    Liljeberg, Pasi
    Plosila, Juha
    Tenhunen, Hannu
    [J]. 15TH CSI INTERNATIONAL SYMPOSIUM ON COMPUTER ARCHITECTURE AND DIGITAL SYSTEMS (CADS 2010), 2010, : 35 - 41
  • [28] G-CARA: a Global Congestion-Aware Routing Algorithm for traffic management in 3D networks-on-chip
    Nosrati, Nooshin
    Shahhoseini, Hadi Shahriar
    [J]. 2017 25TH IRANIAN CONFERENCE ON ELECTRICAL ENGINEERING (ICEE), 2017, : 2188 - 2193
  • [29] Performance analysis of the 2-D networks-on-chip
    Wang, Wei
    Qiao, Lin
    Yang, Guangwen
    Tang, Zhizhong
    [J]. Jisuanji Yanjiu yu Fazhan/Computer Research and Development, 2009, 46 (10): : 1601 - 1611
  • [30] 2D and 3D Bayesian Displacement Estimation
    Byram, Brett
    Rotemberg, Veronica
    Trahey, Gregg
    [J]. 2012 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2012, : 2540 - 2543