Finite element analysis for solder ball failures in chip scale package

被引：35
|
作者：
Lee, T [1 ]
Lee, J [1 ]
Jung, I [1 ]
机构：
[1] Samsung Elect Co Ltd, Package Dev Team, Suwon 449711, South Korea
来源：
MICROELECTRONICS RELIABILITY | 1998年 / 38卷 / 12期
关键词：
D O I：
10.1016/S0026-2714(98)00163-2
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The failure mechanism of solder ball connect in chip scale package (CSP) utilizing wire-bonded ball grid array was elucidated using finite element analysis in this study. The macro-micro-coupling technique was used in the current model. There exist two factors which contribute to solder ball cracking: shear stress due to thermal expansion mismatch between the package and the PCB and warpage of the package itself. This study revealed that shear stress due to the thermal expansion mismatch prevailed over warpage of the package in causing the solder ball cracking in the present type of CSP. (C) 1998 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：1941 / 1947
页数：7
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