Antenna-In-Package Solution for Millimeter-wave Applications Implemented in A Microwave-compatible Multilayer PCB Technology

被引：0
|
作者：
Enayati, Amin [1 ,2 ,3 ]
Deraedt, Walter [1 ]
Vandenbosch, Guy A. E. [2 ]
Raisanen, Antti V. [3 ]
机构：
[1] IMEC, RFCDM Grp, Leuven, Belgium
[2] Katholieke Univ Leuven, Elect Engn Dept, ESAT, Leuven, Belgium
[3] Aalto Univ, Dept Radio Sci & Engn, Espoo, Finland
来源：
2011 41ST EUROPEAN MICROWAVE CONFERENCE | 2011年
关键词：
component; millimete-wave frequencies; antenna-in-package solutions;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A multi-layer PCB technology is used to implement an antenna-in-package solution for millimeter-wave-frequency applications. The antenna is a 1x2 array of dipoles fed by a vialess balun structure. The measurement and simulation results are compared for return loss and radiation pattern characteristics.
引用
收藏
页码：1161 / 1164
页数：4
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