End-fire Antenna-in-package Solution for Millimeter-wave Applications in a Teflon-based PCB Technology

被引：0
|
作者：
Enayati, Amin [1 ]
De Raedt, Walter [1 ]
Ocket, Ilja [2 ]
Vandenbosch, Guy A. E. [2 ]
机构：
[1] Interuniv Microelect Ctr IMEC, RF Component Design & Modeling Grp, Louvain, Belgium
[2] KU Leuven Univ, TELEMIC Grp, Leuven, Belgium
来源：
2013 EUROPEAN MICROWAVE CONFERENCE (EUMC) | 2013年
关键词：
Antenna-in-package; multilayer PCB; antipodal Vivaldi antenna; millimeter-wave communications;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An antenna-in-package solution for millimeter-wave applications has been introduced. The antenna which has an antipodal Vivaldi architecture has been implemented in a multilayer Teflon-based PCB technology. This technology not only helps to reduce the interconnect losses but because of its multilayer stack also allows for promising integration ideas. The antenna which has an end-fire radiating pattern has been measured for its electrical performance such as gain and return loss. Its return loss is better than 10 dB from 40 GHz to 90 GHz. Also it shows gain values of about 4.5 dB with a deviation of less than 1 dB from 57 GHz to 66 GHz which makes it a promising choice for 60-GHz communication systems.
引用
收藏
页码：48 / 51
页数：4
相关论文
共 50 条
  • [1] Millimeter-Wave Horn-Type Antenna-in-Package Solution Fabricated in a Teflon-Based Multilayer PCB Technology
    Enayati, Amin
    Vandenbosch, Guy A. E.
    De Raedt, Walter
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2013, 61 (04) : 1581 - 1590
  • [2] Antenna-In-Package Solution for Millimeter-wave Applications Implemented in A Microwave-compatible Multilayer PCB Technology
    Enayati, Amin
    Deraedt, Walter
    Vandenbosch, Guy A. E.
    Raisanen, Antti V.
    2011 6TH EUROPEAN MICROWAVE INTEGRATED CIRCUIT CONFERENCE, 2011, : 600 - 603
  • [3] LTCC Antenna-In-Package Solution for Millimeter-wave Applications
    Enayati, Amin
    Aghdam, Karim Mohmmad-pour
    De Raedt, Walter
    Vandenbosch, Guy A. E.
    2011 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION (APSURSI), 2011, : 861 - 864
  • [4] Antenna-In-Package Solution for Millimeter-wave Applications Implemented in A Microwave-compatible Multilayer PCB Technology
    Enayati, Amin
    Deraedt, Walter
    Vandenbosch, Guy A. E.
    Raisanen, Antti V.
    2011 41ST EUROPEAN MICROWAVE CONFERENCE, 2011, : 1161 - 1164
  • [5] Antenna-in-Package Solution for Millimeter-wave Applications: Slotted-Patch in a Multilayer PCB
    Enayati, Amin
    De Raedt, Walter
    Vandenbosch, Guy A. E.
    2012 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM (APSURSI), 2012,
  • [6] Directive Millimeter-Wave End-Fire Diplexing Antenna for IoT Applications
    Karami, Farzad
    Boutayeb, Halim
    Talbi, Larbi
    IEEE INTERNET OF THINGS JOURNAL, 2023, 10 (22) : 19874 - 19882
  • [7] An End-Fire Dual Circularly Polarized Antenna for Millimeter-Wave Applications
    Shao, Chan
    Yang, Yu-Hang
    Zhou, Shi-Gang
    Cui, Lun
    2021 IEEE MTT-S INTERNATIONAL MICROWAVE WORKSHOP SERIES ON ADVANCED MATERIALS AND PROCESSES FOR RF AND THZ APPLICATIONS (IMWS-AMP), 2021, : 338 - 340
  • [8] Millimeter-Wave Antenna-in-Package Design Validation Solution in Wireless Communication Applications
    Hsieh, Sheng-Chi
    Chu, Fu-Cheng
    Ho, Cheng-Yu
    Wang, Chen-Chao
    2021 IEEE CPMT SYMPOSIUM JAPAN (ICSJ), 2021, : 1 - 4
  • [9] A Multibeam End-Fire Magnetoelectric Dipole Antenna Array for Millimeter-Wave Applications
    Li, Yujian
    Luk, Kwai-Man
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2016, 64 (07) : 2894 - 2904
  • [10] Millimeter-Wave Antenna-in-Package Solutions for WiGig and Backhaul Applications
    Bisognin, A.
    Titz, D.
    Luxey, C.
    Jacquemod, G.
    Costa, Jorge R.
    Pilard, R.
    Gianesello, F.
    Gloria, D.
    Lima, Eduardo B.
    Fernandes, Carlos A.
    Laporte, Claire
    Ezzedine, Hilal
    Devillers, Frederic
    2015 INTERNATIONAL WORKSHOP ON ANTENNA TECHNOLOGY (IWAT), 2015, : 52 - 55
12345