Transient Analysis of Crosstalk Noise Effects in SWCNT Bundle On-Chip Interconnects Using MRTD Technique

Carbon nanotube bundles are being considered as a potential on-chip interconnect replacement for conventional copper on-chip interconnects in the nanoscale regime of recent IC technology. This paper analyzes the signal integrity analysis of CMOS gate-driven single-walled carbon nanotubes (SWCNTs) bundle on-chip interconnects. The wavelet-based numerical model Multiresolution Time Domain (MRTD) method is used for the transient analysis of SWCNTs bundles on-chip interconnects. The proposed MRTD model is used to perform transient analysis for parameters of signal integrity, peak crosstalk, and propagation delay estimations. The obtained results of the proposed MRTD model are compared with those of the conventional Finite Difference Time Domains (FDTD) model and it is validated with SPICE simulator at 32 nm technology node and also compared with multiwalled CNT (MWCNT) interconnects at 22 nm. The MRTD model results show excellent agreements to SPICE with less than 0.41% error. The elapsed CPU runtimes for the MRTD model are significantly less compared to SPICE. The MRTD model is used to interconnects the model with two and three lines and can be extended to an M-coupled line. The results of the proposed model are closely matched to those of SPICE simulations.