Laser shockwave cleaning of EUV reticles

被引:2
|
作者
Lammers, N. A. [1 ]
Bleeker, A. [2 ]
机构
[1] Eindhoven Univ Technol, Fac Appl Phys, NL-5600 MB Eindhoven, Netherlands
[2] ASML, Veldhoven, Netherlands
来源
关键词
laser; shockwave; cleaning; EUV; reticles;
D O I
10.1117/12.746388
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Particles on the surface of the EUV reticle can cause serious imaging errors during exposure. Laser shockwave cleaning is a novel cleaning method, that shows great potential to remove these particles, without destroying the delicate surface of the reticle. In an effort to assess the cleaning performance of this method, a number of cleaning experiments were performed on wafers contaminated with glass spheres. These experiments showed that with the current setup, it was possible to remove particles as small as 500 nm from the surface of the wafer, at gap distances of 0.5 and 1.0 mm. Furthermore, the transient behaviour of the shockwave was studied with laser flash shadowgraphy. This showed that the shockwave is initially elliptical in shape, and that it can be described by the Taylor & Sedov solution for a point explosion.
引用
收藏
页数:12
相关论文
共 50 条
  • [1] Particle Cleaning of EUV Reticles
    Scaccabarozzi, Luigi
    Lammers, Niels A.
    Moors, Roel
    Banine, Vadim
    [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2009, 23 (12) : 1603 - 1622
  • [2] Inspection of EUV reticles
    Pettibone, D
    Veldman, A
    Liang, T
    Stivers, AR
    Mangat, P
    Lu, B
    Hector, S
    Wasson, J
    Blaedel, K
    Fisch, E
    Walker, DM
    [J]. EMERGING LITHOGRAPHIC TECHNOLOGIES VI, PTS 1 AND 2, 2002, 4688 : 363 - 374
  • [3] UV inspection of EUV and SCALPEL reticles
    Pettibone, DW
    Bareket, N
    Liang, T
    Stivers, AR
    Hector, SD
    Mangat, PJS
    Resnick, DJ
    Lercel, M
    Lawliss, M
    Magg, C
    Novembre, A
    Farrow, R
    [J]. 20TH ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, 2000, 4186 : 241 - 249
  • [4] Optical inspection of EUV and SCALPEL reticles
    Pettibone, DW
    Stokowski, S
    [J]. PHOTOMASK AND NEXT-GENERATION LITHOGRAPHY MASK TECHNOLOGY VIII, 2001, 4409 : 710 - 717
  • [5] Analysis and Characterization of Contamination in EUV Reticles
    Okoroanyanwu, Uzodinma
    Dittmar, Kornelia
    Fahr, Torsten
    Wallow, Tom
    LaFontaine, Bruno
    Wood, Obert
    Holfeld, Christian
    Bubke, Karsten
    Peters, Jan-Hendrik
    [J]. EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY, 2010, 7636
  • [6] Shockwave-induced deformation of organic particles during laser shockwave cleaning
    Kim, Tae Hoon
    Cho, Hanchul
    Busnaina, Ahmed
    Park, Jin-Goo
    Kim, Dongsik
    [J]. JOURNAL OF APPLIED PHYSICS, 2013, 114 (06)
  • [7] Full field EUV lithography: Lessons learnt on EUV ADT imaging, EUV resist, and EUV reticles
    Hendrickx, E.
    Goethals, A. M.
    Niroomand, A.
    Jonckheere, R.
    Van Roey, F.
    Lorusso, G. F.
    Hermans, J.
    Baudemprez, B.
    Ronse, K.
    [J]. LITHOGRAPHY ASIA 2008, 2008, 7140
  • [8] Enhancement of laser plasma EUV emission by shockwave-plasma interaction
    de Bruijn, R
    Koshelev, K
    Bijkerk, F
    [J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2003, 36 (18) : L88 - L91
  • [9] Carbon removal from trenches on EUV reticles
    Koster, N. B.
    Geluk, C. P. E. C.
    Versloot, T. W.
    Janssen, J. P. B.
    Fleming, Y.
    Wirtz, T.
    [J]. PHOTOMASK TECHNOLOGY 2014, 2014, 9235
  • [10] Nanoscale Particle Removal Using Wet Laser Shockwave Cleaning
    Kim, Tae Hoon
    Busnaina, Ahmed
    Park, Jin-Goo
    Kim, Dongsik
    [J]. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2012, 1 (02) : P70 - P77