共 50 条
- [1] Predicting the performance of a 3D processor-memory chip stack [J]. IEEE DESIGN & TEST OF COMPUTERS, 2005, 22 (06): : 540 - 547
- [4] Bridging the processor-memory performance gap with 3D IC technology [J]. IEEE DESIGN & TEST OF COMPUTERS, 2005, 22 (06): : 556 - 564
- [6] Xylem: Enhancing Vertical Thermal Conduction in 3D Processor-Memory Stacks [J]. 50TH ANNUAL IEEE/ACM INTERNATIONAL SYMPOSIUM ON MICROARCHITECTURE (MICRO), 2017, : 546 - 559
- [7] A Monolithic 3D Hybrid Architecture for Energy-Efficient Computation [J]. IEEE TRANSACTIONS ON MULTI-SCALE COMPUTING SYSTEMS, 2018, 4 (04): : 533 - 547
- [8] Efficient Processor Allocation in A Reconfigurable CMP Architecture for Dark Silicon Era [J]. PROCEEDINGS OF THE 34TH IEEE INTERNATIONAL CONFERENCE ON COMPUTER DESIGN (ICCD), 2016, : 336 - 343
- [9] 3D-TTP: Efficient Transient Temperature-Aware Power Budgeting for 3D-Stacked Processor-Memory Systems [J]. 2023 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI, ISVLSI, 2023, : 241 - 246
- [10] High Performance 3D CMP Design with Stacked Hybrid Memory Architecture in the Dark Silicon Era Using a Convex Optimization Model [J]. 2016 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2016, : 2607 - 2610