Thermal resistance of nanowire-plane interfaces

被引:44
|
作者
Bahadur, V [1 ]
Xu, J [1 ]
Liu, Y [1 ]
Fisher, TS [1 ]
机构
[1] Purdue Univ, Sch Mech Engn & Birck, Nanotechnol Ctr, W Lafayette, IN 47907 USA
来源
关键词
thermal contact resistance; nanowire; constriction; van der Waals force;
D O I
10.1115/1.1865217
中图分类号
O414.1 [热力学];
学科分类号
摘要
This paper employs continuum principles combined with van der Waals theory to estimate the thermal contact resistance between nanowires and planar substrates. This resistance is modeled using elastic deformation theory and thermal resistance relations. The contact force between a nanowire and substrate is obtained through a calculation of the van der Waals interaction energy between the two. The model estimates numerical values of constriction and gap resistances for several nanowire-substrate combinations with water and air as the surrounding media. The total interface resistance is almost equal to the gap resistance when the surrounding medium has a high thermal conductivity. For a low-conductivity medium, the interface resistance is dominated by the constriction resistance, which itself depends significantly on nanowire and substrate conductivities. A trend observed in all calculations is that the interface resistance increases with smaller nanowires, showing that interface resistance will be a significant parameter in the design and performance of nanoelectronic devices.
引用
收藏
页码:664 / 668
页数:5
相关论文
共 50 条
  • [21] Thermal resistance of a nanoscale point contact to an indium arsenide nanowire
    Zhou, Feng
    Persson, Ann
    Samuelson, Lars
    Linke, Heiner
    Shi, Li
    APPLIED PHYSICS LETTERS, 2011, 99 (06)
  • [22] Predominance of thermal contact resistance in a silicon nanowire on a planar substrate
    Chalopin, Yann
    Gillet, Jean-Numa
    Volz, Sebastian
    PHYSICAL REVIEW B, 2008, 77 (23):
  • [23] Metallic nanowire networks: effects of thermal annealing on electrical resistance
    Langley, D. P.
    Lagrange, M.
    Giusti, G.
    Jimenez, C.
    Brechet, Y.
    Nguyen, N. D.
    Bellet, D.
    NANOSCALE, 2014, 6 (22) : 13535 - 13543
  • [24] MEASUREMENT TECHNIQUE OF IN-PLANE THERMAL RESISTANCE OF PCB
    Hatakeyama, Tomoyuki
    Ishizuka, Masaru
    Nakagawa, Shinji
    Nakano, Yuta
    Hirokawa, Masataka
    Tomimura, Toshio
    PROCEEDINGS OF THE ASME/JSME 8TH THERMAL ENGINEERING JOINT CONFERENCE 2011, VOL 1 PTS A AND B, 2011, : 1177 - +
  • [25] Thermal resistance of grain boundary interfaces in polycrystalline aluminum nitride
    Pélissonnier-Grosjean, C
    Fournier, D
    Thorel, A
    JOURNAL DE PHYSIQUE IV, 1999, 9 (P4): : 201 - 206
  • [26] Graphene mediated thermal resistance reduction at strongly coupled interfaces
    Hu, Ming
    Poulikakos, Dimos
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2013, 62 : 205 - 213
  • [27] Thermal joint resistance of polymer-metal rough interfaces
    Bahrami, M
    Yovanovich, MM
    Marotta, EE
    JOURNAL OF ELECTRONIC PACKAGING, 2006, 128 (01) : 23 - 29
  • [28] The effect of solid interfaces on thermal contact resistance at low temperature
    Xu, L
    Yang, J
    Xu, JM
    Li, SM
    Xiong, W
    Zhang, T
    ADVANCES IN CRYOGENIC ENGINEERING, VOL 43 PTS A AND B, 1998, 43 : 1369 - 1375
  • [29] Effects of Porosity on Thermal Resistance Aging at Submicron Silver Interfaces
    Wang, Jian
    Zhang, Mowen
    Yang, Chao
    He, Zhiyuan
    Fu, Zhiwei
    Yang, Jia-Yue
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [30] Thermoelectric power, electrical and thermal resistance, and magnetoresistance of nanowire composites.
    Heremans, JP
    THERMOELECTRIC MATERIALS 2003-RESEARCH AND APPLICATIONS, 2004, 793 : 3 - 14