Electrodeposition of copper-tin-zinc ternary alloys from disodium ethylenediaminetetraacetate bath

被引:20
|
作者
de Carvalho, Marcos F. [1 ]
Barbano, Elton P. [1 ]
Carlos, Ivani A. [1 ]
机构
[1] Univ Fed Sao Carlos, Dept Quim, BR-13565905 Sao Carlos, SP, Brazil
来源
基金
巴西圣保罗研究基金会;
关键词
Cu-Sn-Zn electrodeposition; EDTA-acid bath; Microstructure; Adhesion; X-ray diffraction; CU-ZN-SN; SUCOPLATE(R) ELECTROPLATING BATH; CU2ZNSNS4; THIN-FILMS; INTERFACIAL REACTIONS; DEPOSITION; ELECTROCHEMISTRY; SULFURIZATION; BEHAVIOR; SOLDERS; PHASE;
D O I
10.1016/j.surfcoat.2014.12.019
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The voltammetric profile of Cu-Sn-Zn ternary alloys electrodeposition onto AISI 1010 steel from an acid bath containing disodium ethylenediaminetetraacetate (EDTA) showed four different cathodic regions, depending on bath composition, which were associated with the reduction of [CuY](2-), [SnY](2-) and [ZnY](2-) complexes through of the analysis of the voltammetric curves together with the energy-dispersive X-ray spectroscopy results. However, Cu-Sn-Zn co-deposition occurred only at electrodeposition potentials (E-d) more negative than 1.26 V, depending on bath composition, indicating that a transition E-d exists wherein a transition from Cu-Sn binary alloy to Cu-Sn-Zn ternary alloy occurred. Analysis of the photomicrographs showed that Cu-Sn-Zn electrodeposits showed dense and uniform morphologies depending on E-d and bath composition. Also, adhesion tests showed that the Cu-Sn-Zn electrodeposits obtained at E-d - 1.70 V, with q(d) of 3.0 C cm(-2), from baths containing 0.20 M CuSO4 + 0.050 M SnCl2 + 0.050 M ZnSO4 and 0.10 M CuSO4 + 0.10 M SnCl2 + 0.10 M ZnSO4 presented good adherence. X-ray diffraction of Cu-Sn-Zn electrodeposits obtained at E-d - 1.70 V, with qd of 3.0 C cm(-2), showed a mixture of Zn, Sn, CuO, ZnO, SnO, eta-Cu6Sn5, Cu20Sn6 and CuZn phases, depending on bath composition, indicating the formation of Cu-Sn-Zn ternary alloy. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:111 / 122
页数:12
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