Electrodeposition of copper-tin-zinc ternary alloys from disodium ethylenediaminetetraacetate bath

被引:20
|
作者
de Carvalho, Marcos F. [1 ]
Barbano, Elton P. [1 ]
Carlos, Ivani A. [1 ]
机构
[1] Univ Fed Sao Carlos, Dept Quim, BR-13565905 Sao Carlos, SP, Brazil
来源
基金
巴西圣保罗研究基金会;
关键词
Cu-Sn-Zn electrodeposition; EDTA-acid bath; Microstructure; Adhesion; X-ray diffraction; CU-ZN-SN; SUCOPLATE(R) ELECTROPLATING BATH; CU2ZNSNS4; THIN-FILMS; INTERFACIAL REACTIONS; DEPOSITION; ELECTROCHEMISTRY; SULFURIZATION; BEHAVIOR; SOLDERS; PHASE;
D O I
10.1016/j.surfcoat.2014.12.019
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The voltammetric profile of Cu-Sn-Zn ternary alloys electrodeposition onto AISI 1010 steel from an acid bath containing disodium ethylenediaminetetraacetate (EDTA) showed four different cathodic regions, depending on bath composition, which were associated with the reduction of [CuY](2-), [SnY](2-) and [ZnY](2-) complexes through of the analysis of the voltammetric curves together with the energy-dispersive X-ray spectroscopy results. However, Cu-Sn-Zn co-deposition occurred only at electrodeposition potentials (E-d) more negative than 1.26 V, depending on bath composition, indicating that a transition E-d exists wherein a transition from Cu-Sn binary alloy to Cu-Sn-Zn ternary alloy occurred. Analysis of the photomicrographs showed that Cu-Sn-Zn electrodeposits showed dense and uniform morphologies depending on E-d and bath composition. Also, adhesion tests showed that the Cu-Sn-Zn electrodeposits obtained at E-d - 1.70 V, with q(d) of 3.0 C cm(-2), from baths containing 0.20 M CuSO4 + 0.050 M SnCl2 + 0.050 M ZnSO4 and 0.10 M CuSO4 + 0.10 M SnCl2 + 0.10 M ZnSO4 presented good adherence. X-ray diffraction of Cu-Sn-Zn electrodeposits obtained at E-d - 1.70 V, with qd of 3.0 C cm(-2), showed a mixture of Zn, Sn, CuO, ZnO, SnO, eta-Cu6Sn5, Cu20Sn6 and CuZn phases, depending on bath composition, indicating the formation of Cu-Sn-Zn ternary alloy. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:111 / 122
页数:12
相关论文
共 50 条
  • [31] ELECTRODEPOSITION OF COPPER FROM SULPHMATE BATH
    VENKATACHALAM, S
    [J]. JOURNAL OF SCIENTIFIC & INDUSTRIAL RESEARCH, 1962, 21 (05): : 145 - +
  • [32] ELECTRODEPOSITION OF COPPER FROM THE MONOETHANOLAMINE BATH
    CHAR, TLR
    SHIVARAMAN, NB
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1953, 100 (05) : 227 - 231
  • [33] ELECTRODEPOSITION OF COPPER-CADMIUM ALLOYS FROM ETHYLENE DIAMINETETRACETIC ACID BATH
    KRISHNAMOORTHY, PK
    MUKUNDA, PG
    SIRCAR, SC
    [J]. INDIAN JOURNAL OF TECHNOLOGY, 1967, 5 (11): : 350 - +
  • [34] ELECTRODEPOSITION OF COPPER-ZINC TIN ALLOY FROM PYROPHOSPHATE ELECTROLYTES
    GUSEVA, GN
    VAGRAMYAN, TA
    [J]. PROTECTION OF METALS, 1985, 21 (03): : 381 - 382
  • [35] Effect of bath temperature on the electrodeposition of copper tin selenide films from aqueous solution
    Zainal, Z
    Kassim, A
    Hussein, MZ
    Ching, CH
    [J]. MATERIALS LETTERS, 2004, 58 (16) : 2199 - 2202
  • [36] A new high strength copper-tin-zinc alloy for connectors and other conductive springs
    Bhargava, AK
    [J]. 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 1139 - 1146
  • [37] A review of developments in the electrodeposition of tin-copper alloys
    Walsh, F. C.
    Low, C. T. J.
    [J]. SURFACE & COATINGS TECHNOLOGY, 2016, 304 : 246 - 262
  • [38] Electrodeposition behaviour of zinc-iron group metal alloys from a methanol bath
    T. TSURU
    S. KOBAYASHI
    T. AKIYAMA
    H. FUKUSHIMA
    S. K. GOGIA
    R. KAMMEL
    [J]. Journal of Applied Electrochemistry, 1997, 27 : 209 - 214
  • [39] Electrodeposition behaviour of zinc-iron group metal alloys from a methanol bath
    Tsuru, T
    Kobayashi, S
    Akiyama, T
    Fukushima, H
    Gogia, SK
    Kammel, R
    [J]. JOURNAL OF APPLIED ELECTROCHEMISTRY, 1997, 27 (02) : 209 - 214
  • [40] ELECTRODEPOSITION OF ZINC FROM A ZINCATE BATH WITH ULTRASOUND
    WALKER, R
    HOLT, NS
    [J]. PLATING AND SURFACE FINISHING, 1981, 68 (02): : 44 - 48