Temperature Field Simulation Analysis of High Temperature Box

被引：0
|
作者：
Qian, Wenxue [1 ]
Yin, Xiaowei [2 ]
Xie, Liyang [1 ]
机构：
[1] Northeastern Univ, Sch Mech Engn & Automat, Shenyang 110004, Peoples R China
[2] Shenyang Inst Engn, Dept Mech Engn, Shenyang 110136, Peoples R China
来源：
MECHATRONICS AND INTELLIGENT MATERIALS, PTS 1 AND 2 | 2011年 / 211-212卷
基金：
中国国家自然科学基金; 高等学校博士学科点专项科研基金;
关键词：
High temperature box; Simulation analysis; Finite element method;
D O I：
10.4028/www.scientific.net/AMR.211-212.925
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
High temperature box is wildly used in many fields. Alone with the increasing of the requirement temperature, the temperature of it becomes more and more high. But it is difficult to test the temperature when the temperature is greater than 2000 degrees C. In this paper, the thermal field of high temperature box is analyzed by finite element method, the result show that the temperature satisfies the design objects.
引用
收藏
页码：925 / +
页数：2
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