Improved silicon light emission for reach- and punch-through devices in standard CMOS

被引:6
|
作者
Venter, Petrus J. [1 ]
du Plessis, Monuko [1 ]
机构
[1] Univ Pretoria, Carl & Emily Fuchs Inst Microelect, Dept EER C, ZA-0002 Pretoria, South Africa
关键词
Punch-through; reach-through; silicon photonics; CMOS; avalanche photoemission; EMITTING DEVICES; DIODES; LEDS;
D O I
10.1117/12.841357
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A key requirement for the success of future microphotonic devices will be the ability to integrate such devices into current mainstream semiconductor technologies. The ability to create silicon-based light sources in a standard CMOS process is therefore very appealing. It is known that avalanche silicon LED efficiency can be increased using reach-and punch-through mechanisms. This paper reveals a technique for improving the operational performance of a silicon light source by increasing the external quantum efficiency and relaxing the separation requirements for the light source operating under the mentioned reach-or punch-through mechanisms in a standard unmodified local oxidation of silicon (LOCOS) CMOS process.
引用
收藏
页数:9
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