The Analysis of 10 Gbps High-Speed Channel of Aerospace Remote Sensing Camera Based on Signal Integrity

被引:0
|
作者
Su Hao-hang [1 ]
Yan Jing-chun [1 ]
机构
[1] Beijing Inst Space Mech & Elect, Key Lab Opt Remote Sensor Technol CAST, Beijing 100094, Peoples R China
关键词
high-speed serial channel; photoelectric links; signal integrity; eye diagram;
D O I
10.1109/ICMMT49418.2020.9386757
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
With the system's frequency climbing, the final imaging quality has been affected by signal integrity problems of the high-speed link, which becomes a bottleneck of restricting the performance of the remote sensing camera system. In this paper, the design of high-speed photoelectric links between PCB in the electronic design of a space remote sensing camera has been taken as an example. The analysis of inter-board photoelectric interconnect links has been proposed, and the signal integrity simulation has been analyzed in the time domain and the frequency domain based on 3D electromagnetic models of high-speed serial links. Compared with the measure data, the eye diagram of simulation results was highly closed to the measured results, the relative error of eye height was 7.3%, and the error of eye width was 11.4%. The analysis method proposed in this paper could effectively predict attenuation and distortion of signal in high-speed serial links, and which could extensively to analysis the signal integrity of the inter-board photoelectric high-speed links.
引用
收藏
页数:3
相关论文
共 50 条
  • [21] Signal integrity simulation and analysis in high-speed interconnects by using FDTD
    Li, EP
    Yuan, WL
    2002 3RD INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, 2002, : 268 - 271
  • [22] Signal and Power Integrity Analysis of High-Speed Links with Silicon Interposer
    Beyene, Wendemagegnehu
    Juneja, Nitin
    Hahm, Yeon-Chang
    Kollipara, Ravi
    Kim, Joohee
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1708 - 1715
  • [23] Signal Integrity Analysis of High Speed Channel considering Thermal Distribution
    Son, Keeyoung
    Kim, Seongguk
    Kim, Minsu
    Lho, Daehwan
    Kim, Keunwoo
    Park, Hyunwook
    Park, Gapyeol
    Kim, Joungho
    IEEE 30TH CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS 2021), 2021,
  • [24] Measurement Analysis and Improvement Technique of Signal Integrity for High-Speed Connectors
    Lin, Han-Nien
    Huang, Yu-Chieh
    Lin, Ming-Shan
    Kung, Tzu-Wen
    2012 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2012, : 609 - 612
  • [25] Comprehensive analysis of the impact of via design on high-speed signal integrity
    Chang, Weng Yew Richard
    See, Kye Yak
    Chua, Eng Kee
    2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 262 - +
  • [26] High-Speed Channel Equalization scheme for 100 Gbps System
    KrishneGowda, Karthik
    Kraemer, Rolf
    Wolf, Andreas C.
    Bammidi, Eswara Rao
    2018 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL TECHNOLOGY (ICIT), 2018, : 1430 - 1435
  • [27] Statistical signal integrity analysis and diagnosis methodology for high-speed systems
    Matoglu, E
    Pham, N
    de Araujo, DN
    Cases, M
    Swaminathan, M
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (04): : 611 - 629
  • [28] The Design and Simulation of Signal Integrity for High-Speed Backplane based on VPX
    Meng Hua
    Yin Liang
    Tan Anju
    Wen Zhaojin
    PROCEEDINGS OF THE 2015 10TH IEEE CONFERENCE ON INDUSTRIAL ELECTRONICS AND APPLICATIONS, 2015, : 1661 - 1664
  • [29] Signal Integrity Analysis of High-speed PCIe Channel with Board-to-Board Interconnect for High-Performance Server
    Kim, Seongguk
    Son, Keeyoung
    Yoon, Jiwon
    Shin, Taein
    Kim, Keunwoo
    Sim, Boogyo
    Park, Joonsang
    Cho, Seonguk
    Kim, Jihun
    Kim, Haeyeon
    Kim, Joungho
    Park, Hyunwook
    IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS, EDAPS 2023, 2023,
  • [30] High-speed GDDRIII system implementation by channel signal and power integrity factorial design
    Hsu, Jimmy
    Hsiao, Randy
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1953 - +