Comparison of the Switching Energy Losses in Cascode and Enhancement-Mode GaN HEMTs

被引:2
|
作者
Vukic, Vladimir Dj. [1 ]
Mrvic, Jovan [1 ]
Katic, Vladimir A. [2 ]
机构
[1] Univ Belgrade, Elect Engn Inst Nikola Tesla, Belgrade, Serbia
[2] Univ Novi Sad, Fac Tech Sci, Novi Sad, Serbia
关键词
gallium nitride (GaN); cascode structure; enhancement mode; high electron mobility transistor (HEMT); switching losses; SPICE simulation;
D O I
10.1109/pee.2019.8923198
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper are presented results of mutual comparison of the switching waveforms and energy losses, recorded during the turn-on and turn-off switching transients in GaN HEMTs. Switching losses were examined with the double-pulse test, using a SPICE computer simulation program. Detailed simulation models of one each cascode and enhancement-mode GaN HEMTs were used. Generated simulation results were compared with the experimental results procured on a bridgeless totem-pole power factor correction circuit, utilising the tested cascode GaN HEMT. While cascode HEMTs, in general, demonstrated higher switching losses, e-mode transistors were much more prone to the subcritically dumped oscillatory response during the hard switching. Influences of the implemented packaging and technology on the recorded response of cascode and e-mode HEMTs were analysed.
引用
收藏
页数:5
相关论文
共 50 条
  • [21] Recess-free enhancement-mode AlGaN/GaN RF HEMTs on Si substrate
    Luan, Tiantian
    Huang, Sen
    Jing, Guanjun
    Fan, Jie
    Yin, Haibo
    Gao, Xinguo
    Zhang, Sheng
    Wei, Ke
    Li, Yankui
    Jiang, Qimeng
    Wang, Xinhua
    Hou, Bin
    Yang, Ling
    Ma, Xiaohua
    Liu, Xinyu
    [J]. JOURNAL OF SEMICONDUCTORS, 2024, 45 (06)
  • [22] Enhancement-Mode GaN MIS-HEMTs With LaHfOx Gate Insulator for Power Application
    Lin, Yueh Chin
    Huang, Yu Xiang
    Huang, Gung Ning
    Wu, Chia Hsun
    Yao, Jing Neng
    Chu, Chung Ming
    Chang, Shane
    Hsu, Chia Chieh
    Lee, Jin Hwa
    Kakushima, Kuniyuki
    Tsutsui, Kazuo
    Iwai, Hiroshi
    Chang, Edward Yi
    [J]. IEEE ELECTRON DEVICE LETTERS, 2017, 38 (08) : 1101 - 1104
  • [23] A Gate Overdrive Protection Technique for Improved Reliability in AlGaN/GaN Enhancement-Mode HEMTs
    Kwan, Alex Man Ho
    Chen, Kevin J.
    [J]. IEEE ELECTRON DEVICE LETTERS, 2013, 34 (01) : 30 - 32
  • [24] Characteristic comparison of AlGaN/GaN enhancement-mode HEMTs with CHF3 and CF4 surface treatment
    Chen, C. H.
    Yang, C. W.
    Chiu, H. C.
    Fu, Jeffrey. S.
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2012, 30 (02):
  • [25] An enhancement-mode AlInN/GaN HEMTs combining intrinsic GaN cap layer and AlGaN back barrier layer
    Zhang, Cong
    Yao, Ruohe
    [J]. SOLID STATE COMMUNICATIONS, 2023, 366
  • [26] Enhancement-mode AlGaN/GaN HEMTs with low on-resistance and low knee-voltage
    Cai, Yong
    Zhou, Yugang
    Lau, Kei May
    Chen, Kevin J.
    [J]. IEICE TRANSACTIONS ON ELECTRONICS, 2006, E89C (07): : 1025 - 1030
  • [27] Analysis of Crosstalk and Suppression Methods for Enhancement-Mode GaN HEMTs in A Phase-Leg Topology
    Qin, Haihong
    Wang, Wenlu
    Bu, Feifei
    Peng, Zihe
    Liu, Ao
    Bai, Song
    [J]. 2021 IEEE WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS IN ASIA (WIPDA ASIA 2021), 2021, : 147 - 152
  • [28] Enhancement-mode GaN Hybrid MOS-HEMTs with Breakdown Voltage of 1300V
    Tang, K.
    Li, Z.
    Chow, T. P.
    Niiyama, Y.
    Nomura, T.
    Yoshida, S.
    [J]. 2009 21ST INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 2009, : 279 - +
  • [29] On the Source of Oscillatory Behaviour during Switching of Power Enhancement Mode GaN HEMTs
    Efthymiou, Loizos
    Camuso, Gianluca
    Longobardi, Giorgia
    Chien, Terry
    Chen, Max
    Udrea, Florin
    [J]. ENERGIES, 2017, 10 (03):
  • [30] Switching Controllability of High Voltage GaN-HEMTs and The Cascode Connection
    Saito, Wataru
    Saito, Yasunobu
    Fujimoto, Hidetoshi
    Yoshioka, Akira
    Ohno, Tetsuya
    Naka, Toshiyuki
    Sugiyama, Toru
    [J]. 2012 24TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2012, : 229 - 232