An Efficient Simulation System for Inclined UV Lithography Processes of Thick SU-8 Photoresists

A 2-D simulation system based on a 2-D dynamic cellular automata method, integrating aerial image simulation, exposure simulation, post-exposure bake simulation, and development simulation modules is presented for inclined ultraviolet (UV) lithography processes of thick photoresists such as SU-8 photoresists. To verify the simulation system, a series of experiments have been performed for SU-8 2000 series photoresists under UV source with 365 nm (2.6 mW/cm(2)) radiation. The simulation results demonstrate to be in agreement with the experimental results. This is useful to optimize the inclined UV lithography processes of SU-8 photoresists, and to accurately design and control the dimensions of some SU-8 microstructures.