Comparison of resonant tunneling diodes grown on freestanding GaN substrates and sapphire substrates by plasma-assisted molecular-beam epitaxy*

被引:0
|
作者
Zhou, Xiang-Peng [1 ,3 ]
Qiu, Hai-Bing [2 ,3 ]
Yang, Wen-Xian [3 ]
Lu, Shu-Long [3 ]
Zhang, Xue [2 ,3 ]
Jin, Shan [3 ]
Li, Xue-Fei [2 ,3 ]
Bian, Li-Feng [1 ,3 ]
Qin, Hua [3 ]
机构
[1] Univ Sci & Technol China, Sch Microelect, Hefei 230026, Peoples R China
[2] Univ Sci & Technol China, Sch Nanotech & Nanobion, Hefei 230026, Peoples R China
[3] Chinese Acad Sci, Suzhou Inst Nanotech & Nanobion, Key Lab Nanodevices & Applicat, Suzhou 215123, Peoples R China
基金
中国国家自然科学基金; 国家重点研发计划;
关键词
resonant tunneling diodes; negative differential resistance; molecular beam epitaxy; III-nitrides; HETEROSTRUCTURES; INSTABILITIES;
D O I
10.1088/1674-1056/ac0525
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
AlN/GaN resonant tunneling diodes (RTDs) were grown separately on freestanding GaN (FS-GaN) substrates and sapphire substrates by plasma-assisted molecular-beam epitaxy (PA-MBE). Room temperature negative differential resistance (NDR) was obtained under forward bias for the RTDs grown on FS-GaN substrates, with the peak current densities (J (p)) of 175-700 kA/cm(2) and peak-to-valley current ratios (PVCRs) of 1.01-1.21. Two resonant peaks were also observed for some RTDs at room temperature. The effects of two types of substrates on epitaxy quality and device performance of GaN-based RTDs were firstly investigated systematically, showing that lower dislocation densities, flatter surface morphology, and steeper heterogeneous interfaces were the key factors to achieving NDR for RTDs.
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页数:6
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